Data Sheet HMC558A
Rev. 0 | Page 5 of 15
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC558A
TOP VI EW
(Not to Scale)
9
8
7
GND
RF
GND
NIC
NIC
NIC
GND
IF
GND
1
2
3
GND
LO
GND
456
12 11 10
15000-002
NOTES
1. NI C = NO I NT E RNAL CONNEC T I ON.
2. EXPOSED PAD. CONNECT T HE EXPOSED PAD TO A LO W
IM P EDANCE THERMA L AND ELECTRICAL GRO UND P LANE.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. See Figure 6 for the ground interface schematic.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
5 IF
DC-Coupled IF. For applications not requiring operation to dc, dc block this port externally using a series
capacitor whose value is chosen to pass the necessary IF frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current, or device nonfunction and possible device failure may
result. See Figure 5 for the IF interface schematic.
8 RF RF Port. This pin is ac-coupled internally and matched to 50 Ω. See Figure 3 for the RF interface schematic.
10, 11, 12 NIC No Internal Connection. These pins can be grounded.
EPAD Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.
INTERFACE SCHEMATICS
RF
15000-003
Figure 3. RF Interface
LO
15000-00
Figure 4. LO Interface
I
15000-005
Figure 5. IF Interface
GND
15000-006
Figure 6. Ground Interface
