HMC558A Data Sheet
Rev. 0 | Page 4 of 15
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 25 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Maximum Junction Temperature 175°C
Continuous P
DISS
(T = 85°C) (Derate
5.5 mW/°C Above 85°C)
495 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range (Soldering 60 sec) −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 2500 V (Class 2)
Field Induced Charged Device Model
(FICDM)
1000 V (Class C5)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
Package Type θ
JC
Unit
E-12-1
1
180 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
