DATA SHEET
SEMICONDUCTOR
http://www.yeashin.com 1 REV.03 20130520
H
ZS47xxA
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Standard zener voltage tolerance ±5%.
Low inductance.
Low profile package.
Built-in strain relief.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen free parts, ex. ΖS4728Α-H.
•
•
•
•
•
•
Mechanical data
•
• Case :
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
Epoxy : UL94-V0 rated flame retardant
Molded plastic,JEDEC DO-214AC / SMA
1
0
0
0
m
W S
u
r
f
a
c
e M
o
u
n
t Z
e
n
e
r
D
i
o
d
e
s - 3
.
3
V-
1
0
0
V
P
A
R
A
M
E
T
E
R
C
O
N
D
I
T
I
O
N
S
S
y
m
b
o
l
V
F
P
D
M
I
N
.
T
Y
P
.
M
A
X
.
1
.
2
0
1
0
0
0
U
N
I
T
V
m
W
S
t
o
r
a
g
e t
e
m
p
e
r
a
t
u
r
e
O
p
e
r
a
t
i
n
g t
e
m
p
e
r
a
t
u
r
e
T
S
T
G
T
J
-
5
5
-65
+
1
5
0
+175
o
C
o
C
o
Maximum ratings (at T =25 C unless otherwise noted)
A
F
o
r
w
a
r
d v
o
l
t
a
g
e
Power Dissipation
I
= 2
0
0 m
A
F
0.196(4.9)
0.180(4.5)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
0.068(1.7)
0.060(1.5)
0.032 (0.8) Typ.0.032(0.8) Typ.
Dimensions in inches and (millimeters)
SMA
Thermal resistance
R
θ
J
C
J
u
n
c
t
i
o
n t
o c
a
s
e
(
N
o
t
e 1
)
3
0
o
C/W
J
u
n
c
t
i
o
n t
o a
m
b
i
e
n
t
(
N
o
t
e 1
)
5
0
R
θJA
Note：1. Mounted on FR-4 PCB0.2"x0.2"(5x5mm)
a
t
T
L
=
7
5
°
C
