ZMM5221B thru ZMM5267B
Features
Plannar Die constuction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
V
Z
–tolerance ± 5%
Weight 0.035g
Applications
Voltage stabilization
Maximum Ratings
T
j
= 25 C
Item Test Conditions Type Symbol Value Unit
Power dissipation
T
amb
=25
C
P
TOT
500 mW
Z–current I
Z
P
V
/V
Z
mA
Junction temperature T
j
-65 to +175 C
Storage temperature range T
stg
–65 to +175 C
Maximum Thermal Resistance
T
j
= 25 C
Parameter Test Conditions Symbol Value Unit
Junction ambient l=9.5mm (3/8”), T
L
=constant R
thJA
300 K/W
Electrical Characteristics
T
j
= 25 C
Parameter Test Conditions Type Symbol Min Typ Max Unit
Forward voltage I
F
=200mA V
F
1.1 V
Unit:inch(mm)
.020(0.5)
.063(1.6)
.055(1.4)DIA.
.020(0.5)
.012(0.3)
.012(0.3)
.130(3.3)
.146(3.7)
PB FREE PRODUCT
500mW Mini melf ZENER Diodes