Chip Resistor Surface Mount
Electrical Test not required
Magnification 50X
SMD conditions:
1
st
step: method B, aging 4 hours at 155 °C
dry heat
2
nd
step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
Well tinned (≥95% covered)
No visible damage
Leadfree solder, 260 °C, 30 seconds
immersion time
- Resistance to
Soldering Heat
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
AEC-Q200 Test 7
MIL-STD-202-Method 103
1,000 hours; 85 °C / 85% RH
10% of operating power
Measurement at 24± 4 hours after test
conclusion.
