DWG.NO. DWG.NO.
MS5D3300 7/12
H04-004-03a
Fuji Electric Device Technology Co.,Ltd.
This material and the information herein is the property of Fuji Electric
Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent,
or disclosed in any way whatsoever for the use of any third party nor used
for the manufacturing purposes without the express written consent of
Fu
i Electric Device Technolo
Co.,Ltd.
INSTALLATION
Soldering involves temperatures which exceed the device storage temperature rating. To avoid
device damage and to ensure reliability, observe the following guidelines from the quality
assurance standard.
Table 1: Solder temperature and duration
Method
Solder
temperature
Duration
Flow 260 5 10 1sec
Soldering iron 350 10 3.5 0.5sec
The immersion depth of the lead should basically be up to the lead stopper and the distance
should be a maximum of 1.5mm from the device.
When flow-soldering, be careful to avoid immersing the package in the solder bath.
Refer to the following torque reference When mounting the device on a heat sink. Excess
torque applied to the mounting screw causes damage to the device and weak torque will
increase the thermal resistance, both of which conditions may destroy the device.
Table 2:Recommended tightening torque
Package style Screw Recommended tightening torque
TO-220 M3 0.3 0.5N m
The heat sink should have a flatness within 30 m and roughness within 10 m. Also, keep
the tightening torque within the limits of this specification.
Improper handling may cause isolation breakdown leading to a critical accident.
We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is
important to evenly apply the compound and to eliminate any air voids.
STORAGE
The Diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45
to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only
deionized water or boiled water, since the chlorine in tap water may corrode the leads.
The Diodes should not be subjected to rapid changes in temperature to avoid condensation on
the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is
steady.
The Diodes should not be stored on top of each other, since this may cause excessive external
force on the case.
The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may
cause presoldered connections to go fail during later processing.
The Diodes should be stored in antistatic containers or shipping bags.
