May 11, 2006 S29WS-J_00_A6 S29WS128J/064J 95
Data Sheet
VBR080 - 80-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm (64Mb)
Note: BSC is an ANSI standard for Basic Space Centering
3366 \ 16-038.25d1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBR 080
JEDEC N/A
9.00 mm x 7.00 mm NOM
PACKAGE
SYMBOL MIN NOM MAX NOTE
A --- --- 1.00 OVERALL THICKNESS
A1 0.17 - -- --- BALL HEIGHT
A2 0.62 --- 0.73 BODY THICKNESS
D 9.00 BSC. BODY SIZE
E 7.00 BSC. BODY SIZE
D1 7.20 BSC. BALL FOOTPRINT
E1 5.60 BSC. BALL FOOTPRINT
MD 10 ROW MATRIX SIZE D DIRECTION
ME 8 ROW MATRIX SIZE E DIRECTION
N 80 TOTAL BALL COUNT
φb 0.35 --- 0.45 BALL DIAMETER
e 0.80 BSC. BALL PITCH
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
NONE DEPOPULATED SOLDER BALLS
BOTTOM VIEW
A1 CORNER
JK
e
7
BACEDFHG
8
7
6
5
4
3
2
1
e
D1
E1
SE
7
BCA
C
M
φ 0.15
φ 0.08
M
6
NXφb
SD
SIDE VIEW
A2
A
A1
0.20 C
C0.08
C
SEATING PLANE
TOP VIEW
10
C0.15
(2X)
(2X)
C0.15
E
D
A
B
A1 CORNER
INDEX MARK
