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WPM2005
Power Dissipation Characteristics
1. The package of WPM2005 is DFN3x2-8L, surface mounted on FR4 Board using 1 in sq pad sizeˈ
1 oz CuˈR
șJA
is 89 ć/W.
2. The power dissipation P
D
is based on T
J(MAX)
=150°C, and the relation between T
J
and P
D
is T
J
= T
a
+
R
șJA
* P
D
, the maximum power dissipation is determined by R
șJA
.
3. The R
șJA
is the thermal impedance from junction to ambient, using larger PCB pad size can get
smaller R
șJA
and result in larger maximum power dissipation.
89 ć/W when mounted on
a 1 in
2
pad of 1 oz copper.
0 2012 Rev 3.5
Jan,