Page 7 of 9 ASC_WLPN505020 Series_V2.0 Nov. Y2017
6
Solder ability. At least 90% of
surface of terminal
electrode is
covered by new
solder.
The t
est samples shall be dipped in flux, and then Immersed in
molten solder as shown in below table.
Flux: Methanol solution containing rosin 25%
Solder Temperature 245±deg C
Time 5±1.0 S.
Immersing Speed 25 mm/s
7
Temperature
Characteristics.
△L/L:within±20%
No abnormality
observed in
appearance
Measurement of inductance shall be taken at temperature rnge within -
25 deg C to +85 deg C.
With reference to inductance value at +20 deg C, change rate shall be
calculated.
8
Thermal shock.
△L/L:within±10%
No abnormality
observed in
appearance.
The test samples shall be soldered to test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed at specified shown in below table in
sequence.
The temperature cycle shall be repeated 100 cycles.
Conditions of steps for 1 cycle
Step
Temperature Time(min)
1 -40±3 deg C 30±3
2 Room Temp 3 maximum
3 85±2 deg C 30±3
4 Room Temp 3 maximum
9
Low
Temperature life
Test.
△L/L:within±10%
No abnormality
observed in
appearance.
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
After that, the test samples shall be placed at test conditions as shown
in below table.
Temperature -40±2 deg C
Time 500 +24/-0 h
10
Loading at high
temperature life
test.
△L/L:within±10%
No abnormality
observed in
appearance.
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and applied the rated current continuously as shown in
below table.
Temperature 85±2 deg C
Applied current
Rated current
(Refer to Page 3)
Time 500+24/-0 h
11
Damp heat life
test.
△L/L:within±10%
No abnormality
observed in
appearance.
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and humidity as shown in below table.
Temperature 60±2 deg C
Humidity 90~95%RH
Time 500+24/-0 h
12
Loading under
Damp heat life
test.
△L/L:within±10%
No abnormality
observed in
appearance.
The test samples shall be soldered to the test board by the reflow
soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at specified
temperature and humidity and applied the rated current continuously
as shown in below table.
Temperature 60±2 deg C
Humidity 90~95%RH
Applied current Rated current (Refer to Page 3)
Time 500+24/-0 h
