SUPERWORLD ELECTRONICS (S) PTE LTD
NOTE : Specifications subject to change without notice. Please check our website for latest information.
PG. 5
16.10.2008
WI565050 SERIES
7. RELIABILTY TEST :
MOLDED WIREWOUND CHIP INDUCTORS
A period of 2 hours in each of 3 mutually perpendicular
Directions & times : X, Y, Z directions for 2 hours.
(1 angle, 1 ridge and 2 surface orientations)
Drop from a height of 1m with 981m/s² (100G) altitude
Bend PCB at middle point, the deflection shall be 2mm.
directions (Total 6 hours).
Amplitude : 0.75mm
Frequency : 10~55Hz
Peak temp. : 245±5°C
Refer to reflow curve.
Terminal Strength Push Test Pulling Test :
JIS C 5321:1997
Reference documents:
applied on the right conditions.
dielectric must not be damaged by the forces
Bending Test : The terminal electrode & the
8mm²<A<20mm²
A : Sectional area of terminal
20mm²<A
A<8mm²
>10N 10
>20N
10
Bending Test :
R0.5
Time (sec)Force
>5N
30
X
Pulling Test :
MIL-STD-202G Method 203C
Reference documents:
Drop Test
MIL-STD-202G Method 201A
Reference documents:
Vibration Test
1. No case deformation or change in appearance.
1. No case deformation or change in appearance.
Heat Endurance of
Reflow Soldering
IPC J-STD-020B
Reference documents:
PERFORMANCE
1. No case deformation or change in appearance.
ITEM
No. of cycle : 3
Sample
1.0
Y
10Hz
1Min
Time
55Hz
Freq
TEST CONDITION
4. ǻDCR/DCR<10% or 15%
2. ǻL/L<10%
3. ǻQ/Q < 30%
3. ǻQ/Q < 30%
4. ǻDCR/DCR<10% or 15%
2. ǻL/L<10%
4. ǻDCR/DCR<10% or 15%
3. ǻQ/Q < 30%
2. ǻL/L<10%
270
50
250
200
150
100
300
Preheat
PeakRamp-up Ram p-down
270
260±5°C
Reflow Curve