SUPERWORLD ELECTRONICS (S) PTE LTD
WI565050 SERIES
7. RELIABILTY TEST :
NOTE : Specifications subject to change without notice. Please check our website for latest information.
PG. 4
16.10.2008
MOLDED WIREWOUND CHIP INDUCTORS
MIL-STD-202G Method 108A
Temp
1/2H
Time
More than 95% of termincal electrode should
Physical Characteristics Tests
MIL-STD-202G Method 208H
IPC J-STD-002B
Reference documents:
Solderability Test
be covered with solder.
Solder : lead free
Flux : rosin flux
Dip time : 5 secs.
Solder temperature : 245±5°C
-25°C
1. No case deformation or change in appearance.
1. No case deformation or change in appearance.
1. No case deformation or change in appearance.
Reference documents:
MIL-STD-202G Method 107G
Reference documents:
Thermal shock test
MIL-STD-202G Method 103B
Humidity Test
IEC 68-2-1A 6.1 6.2
Low Temperature Storage Test
Reference documents:
4. ǻDCR/DCR<10% or 15%
Room
0
Temp
85°C
Temp
Step 1 : -40°C for 30 minute
Step 2 : 125°C for 30 minute
Conditions of 1 cycle :
Total : 20 cycles
96H
93%RH
High temperature
0
High humidity
Temp & Humidity
40°C
Conditions
1H
TimeTest
Room
Time : 96±2 hours
Temperature : 40±2°C
Temp
Humidity : 93±3% RH
Low temperature
-25°C
0
Temp
Room
96H
Time
Test
Tested after 1 hour at room temperature
96H
Temperature : -25±2°C
Time : 96±2 hours
Room
Temp
0
High temperature
85°C
Time
1H
Test
1. No case deformation or change in appearance.High Temperature Storage Test
Reference documents:
Environmental Tests
ITEM
2. ǻL/L<10%
3. ǻQ/Q < 30%
PERFORMANCE TEST CONDITION
Tested after 1 hour at room temperature
Temperature : 85±2°C
Time : 96±2 hours
3. ǻQ/Q < 30%
4. ǻDCR/DCR<10% or 15%
2. ǻL/L<10%
1H
4. ǻDCR/DCR<10% or 15%
2. ǻL/L<10%
3. ǻQ/Q < 30%
Tested after 1 hour at room temperature
Room
Temp
4. ǻDCR/DCR<10% or 15%
2. ǻL/L<10%
3. ǻQ/Q < 30%
1/2H