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WEDPS512K32LV-17BC

WEDPS512K32LV-17BC首页预览图
型号: WEDPS512K32LV-17BC
PDF文件:
  • WEDPS512K32LV-17BC PDF文件
  • WEDPS512K32LV-17BC PDF在线浏览
功能描述: 512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
PDF文件大小: 217.97 Kbytes
PDF页数: 共7页
制造商: WEDC[White Electronic Designs Corporation]
制造商LOGO: WEDC[White Electronic Designs Corporation] LOGO
制造商网址: http://www.whiteedc.com
捡单宝
PDF页面索引
100%
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WEDPS512K32V-XBX
June 2004
Rev. 5
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
Low Power Data Retention 'L' Option
TTL Compatible Inputs and Outputs
Fully Static Operation:
• No clock or refresh required.
Three State Output.
This product is subject to change without notice.
FEATURES
Access Times of 12, 15, 17, 20ns
Packaging
143 PBGA, 16mm x 18mm, 288mm
2
Organized as 512Kx32; User Confi gurable as
1Mx16 or 2Mx8
Commercial, Industrial and Military Temperature
Ranges
Low Voltage Operation:
3.3V ± 10% Power Supply
PIN CONFIGURATION FOR WEDPS512K32V-XBX
Pin Description
I/O
0-31
Data Inputs/Outputs
A
0-18
Address Inputs
WE
1-4
# Write Enables
CS
1-4
# Chip Selects
OE# Output Enable
V
CC
Power Supply
GND Ground
NC Not Connected
Block Diagram
WE
1
# CS
1
#
512K X 8
8888
512K X 8
512K X 8 512K X 8
OE#
A
0-18
I/O
0 - 7
I/O
8 - 15
I/O
16 - 23
I/O
24 - 31
WE
2
# CS
2
#WE
3
# CS
3
#WE
4
# CS
4
#
Top View
123456789101112
A - A2 A1 A0 GND GND VCC VCC A18 A17 A16 GND
B CS2# A3 A4 D14 D15 NC CS4# D24 D25 OE# A15 NC
C D9 D8 NC D12 D13 GND VCC D26 D27 WE4# D31 D30
D D10 D11 GND GND GND GND VCC VCC VCC VCC D28 D29
E WE2# GND GND GND GND GND VCC VCC VCC VCC VCC NC
F GND GND GND GND GND GND VCC VCC VCC VCC VCC VCC
G VCC VCC VCC VCC VCC VCC GND GND GND GND GND GND
H CS1# VCC VCC VCC VCC VCC GND GND GND GND GND NC
J D1 D0 VCC VCC VCC VCC GND GND GND GND D23 D22
K D2 D3 NC D7 D5 VCC GND D17 D16 CS3# D20 D21
L WE1# A6 A5 D6 D4 NC WE3# D19 D18 A14 A13 NC
M GND A7 A8 A9 vcc vcc GND GND A10 A11 A12 vcc
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