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WBC-B0202CRAS-01-2004-KJ

WBC-B0202CRAS-01-2004-KJ首页预览图
型号: WBC-B0202CRAS-01-2004-KJ
PDF文件:
  • WBC-B0202CRAS-01-2004-KJ PDF文件
  • WBC-B0202CRAS-01-2004-KJ PDF在线浏览
功能描述: Wire Bondable High Range Chip Resistors
PDF文件大小: 378.36 Kbytes
PDF页数: 共3页
制造商: IRCTT[IRC - a TT electronics Company.]
制造商LOGO: IRCTT[IRC - a TT electronics Company.] LOGO
制造商网址: http://www.irctt.com
捡单宝
PDF页面索引
100%
IRC Advanced Film Division
General Note
IRC reserves the right to make changes in product specifi cation without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Wire Bondable
High Range Chip Resistors
New CHROMAXX
TM
lm system
Discrete or tapped schematics
MIL inspection available
High resistor density
WBC-CR Series
IRC’s WBC-CR series now brings higher ohmic range thin fi lm
capabilities to hybrid applications. Using IRC’s new CHROMAXX
TM
lm system on silicon substrates provides thin fi lm performance on an extremely small footprint. Custom
resistance values, sizes and schematics are available on request from the factory.
Absolute Tolerance
to ±0.1%
Absolute TCR
to ±100ppm/°C
Package Power Rating
(@ 70°C)
250mW
Rated Operating Voltage
(not to exceed P x R )
100V
Operating Temperature
-55°C to +150°C
Noise
<-30dB
Substrate Material
Oxidized Silicon
(10KÅ SiO
2
min)
Substrate Thickness
0.010˝ ±0.001
(0.254mm ±0.025)
Bond Pad
Metallization
Aluminum
10KÅ minimum
Gold
15KÅ
minimum
Backside
R0202 and
T0303
Silicon
(Gold available)
B0202
Gold
3KÅ
minimum
Passivation
Silicon Dioxide or
Silicon Nitride
(not to exceed P x R )
(not to exceed P x R )
Electrical Data
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.020˝ ±0.001
(0.508mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
0.004˝ min bond pad size
Back contact
Back contact
Top contact
Physical Data
R0202 - Discrete
T0303 - Tapped network ½R + ½R
B0202 - Discrete back contact
Top contact
pad chamfered
R
R
½R
½R
0.004˝ min bond pad size
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