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W3H32M64E-SB

W3H32M64E-SB首页预览图
型号: W3H32M64E-SB
PDF文件:
  • W3H32M64E-SB PDF文件
  • W3H32M64E-SB PDF在线浏览
功能描述: 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
PDF文件大小: 231.38 Kbytes
PDF页数: 共6页
制造商: WEDC[White Electronic Designs Corporation]
制造商LOGO: WEDC[White Electronic Designs Corporation] LOGO
制造商网址: http://www.whiteedc.com
捡单宝
PDF页面索引
100%
W3H32M64E-XSBX
ADVANCED*
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
October 2005
Rev. 3
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
FEATURES
Data rate = 667*, 533, 400
Package:
208 Plastic Ball Grid Array (PBGA), 16 x 20mm
• 1.0mm pitch
DDR2 Data Rate = 667*, 533, 400
Supply Voltage = 1.8V ± 0.1V
Differential data strobe (DQS, DQS#) per byte
Internal, pipelined, double data rate architecture
4-bit prefetch architecture
DLL for alignment of DQ and DQS transitions with
clock signal
Four internal banks for concurrent operation
(Per DDR2 SDRAM Die)
Programmable Burst lengths: 4 or 8
Auto Refresh and Self Refresh Modes
On Die Termination (ODT)
Adjustable data – output drive strength
Programmable CAS latency: 3, 4 or 5
Posted CAS additive latency: 0, 1, 2, 3 or 4
Write latency = Read latency - 1* tCK
Commercial, Industrial and Military Temperature
Rang es
Organized as 32M x 64, user confi gurable as 2 x
32M x 32
Weight: W3H32M64E-XSBX - 2.5 grams typical
BENEFITS
62% SPACE SAVINGS vs. FPBGA
Re duced part count
42% I/O reduction vs FPBGA
Re duced trace lengths for low er par a sit ic
ca pac i tance
Suit able for hi-re li abil i ty ap pli ca tions
Upgradeable to 64M x 64 den si ty (con tact fac to ry
for information)
* This product is under development, is not qualifi ed or characterized and is subject
to change or cancellation without notice.
Area 4 x 209mm
2
= 836mm
2
320mm
2
62%
4 x 90 balls = 360 balls 208 Balls 42%
S
A
V
I
N
G
S
I/O
Count
Actual Size
W3H32M64E-XSBX
CSP Approach (mm)
90
FBGA
11.0
19.0
20
16
90
FBGA
11.0
90
FBGA
11.0
90
FBGA
11.0
FIGURE 1 – DENSITY COMPARISONS
White Electronic Designs
W3H32M64E-XSBX
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