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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
April 2005
Rev. 0
W3EG2128M64ETSR-JD3
ADVANCED
2.31
(0.091)
(2x)
133.48
(5.255" MAX.)
3.99
(0.157 (2x))
17.78
(0.700)
10.01
(0.394)
6.35
(0.250)
64.77
(2.550)
1.78
(0.070)
49.53
(1.950)
3.00
(0.118)
(4x)
30.48
(1.20 MAX)
1.27
(0.050 TYP.)
6.35
(0.250)
128.95
(5.077")
131.34
(5.171")
3.81
(0.150 MAX)
3.99
(0.157)
(MIN)
1.27 ± 0.10
(0.050 ± 0.004)
PACKAGE DIMENSIONS FOR JD3
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
ORDERING INFORMATION FOR JD3
Part Number Speed CAS Latency t
RCD
t
RP
Height*
W3EG2128M64ETSR335JD3xG 166MHz/333Mb/s 2.5 3 3 30.48 (1.20")
W3EG2128M64ETSR263JD3xG 133MHz/266Mb/s 2 3 3 30.48 (1.20")
W3EG2128M64ETSR265JD3xG 133MHz/266Mb/s 2.5 3 3 30.48 (1.20")
NOTES:
• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)
• Vendor specifi c part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to
be replaced with the respective vendors code. Consult factory for qualifi ed sourcing options. (M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option