W29EE012
Publication Release Date: March 26, 2002
- 19 - Revision A3
VERSION HISTORY
VERSION
DATE PAGE DESCRIPTION
A1 Jan. 1997 - Initial Issued
A2 Apr. 2000 10 Modify VIH/VIL = 0V/3V and VOH/VOL = 1.5V/1.5V
A3 Mar. 26, 2002
1, 17, 19, 20
Delete Package Description
1,11 Delete Access Time
4, 17 Add in Hardware SID Read function note
4 Modify VDD Power Up/Down Detection in Hardware
Data Protection
18 Add Bonding Pad Diagram
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (H.K.) Ltd.
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
FAX: 852-27552064
Unit 9-15, 22F, Millennium City,
TEL: 852-27513100
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Winbond Electronics (Shanghai) Ltd.
200336 China
FAX: 86-21-62365998
27F, 2299 Yan An W. Rd. Shanghai,
TEL: 86-21-62365999
Winbond Electronics Corporation Japan
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
FAX: 81-45-4781800
7F Daini-ueno BLDG, 3-7-18
TEL: 81-45-4781881
9F, No.480, Rueiguang Rd.,
Neihu Chiu, Taipei, 114,
Taiwan, R.O.C.
