W25Q80BL
- 68 -
11. PACKAGE SPECIFICATION
11.1 8-Pin SOIC 150-mil (Package Code SN)
L
θ
c
D
A1
A
e
b
SEATING PLANE
Y
0.25
GAUGE PLANE
E
H
E
4
1
58
L
θ
c
D
A1
A
e
bbb
SEATING PLANE
Y
0.25
GAUGE PLANE
E
H
E
E
H
E
4
1
58
MILLIMETERS INCHES
SYMBOL
Min Max Min Max
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
b 0.33 0.51 0.013 0.020
c 0.19 0.25 0.008 0.010
E
(3)
3.80 4.00 0.150 0.157
D
(3)
4.80 5.00 0.188 0.196
e
(2)
1.27 BSC 0.050 BSC
H
E
5.80 6.20 0.228 0.244
Y
(4)
--- 0.10 --- 0.004
L 0.40 1.27 0.016 0.050
θ
0° 10° 0° 10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.