SMBJ5333B
THRU
SMBJ5388B
Features
• Low profile package for surface mounting (flat handling
surface for accurate placement)
• Zener Voltage 3.3V to 200V
• High Surge Current Capability
• For available tolerances – see note 1
• Available on Tape and Reel (see EIA std RS-481)
Mechanical Data
• Standard JEDEC outlines as shown
• Terminals gull-wing or c-bend (modified J-bend) tin-lead plated
and solderable per MIL-STD-750, method 2026
• Polarity is indicated by cathode band
• Maximum temperature for soldering: 260
o
C for 10 seconds.
Maximum Ratings @ 25
C Unless Otherwise Specified
Forward Voltage at 1.0A
Current
V
F
1.2 Volts
Steady State Power
Dissipation
P
(AV)
5 Watts
See note 2
Operating and Storage
Temperatures
T
J
, T
STG
-55
o
C to
+ 150
o
C
Thermal Resistance
R
θJL
25
o
C/W
5 Watt
Surface Mount
Silicon
Notes
1. Mounted on copper pads as shown below.
2. Lead temperature at 25
o
C = T
L
at mounting plane. Derate
linearly above 25
o
C to zero power at 150
o
C
www.mccsemi.com
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .078 .116 1.98 2.95
B .075 .089 1.90 2.25
C .002 .008 .05 .20
D ---- - .02 ----- .51
E .035 .055 .90 1.40
F .065 .091 1.65 2.32
G .205 .224 5.21 5.69
H .160 .180 4.06 4.57
J .130 .155 3.30 3.94
DO-214AA
(SMBJ) (Round Lead)
H
J
E
F
G
A
B
D
C
Cathode Band
0.085”
Modified J Bend
omponents
21201 Itasca Street Chatsworth
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MCC
