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LT1W92A

LT1W92A首页预览图
型号: LT1W92A
PDF文件:
  • LT1W92A PDF文件
  • LT1W92A PDF在线浏览
功能描述: 3030 Size, 1.1mm Thickness, MID* Type Full Color Leadless Chip LED Device
PDF文件大小: 36.87 Kbytes
PDF页数: 共1页
制造商: SHARP[Sharp Electrionic Components]
制造商LOGO: SHARP[Sharp Electrionic Components] LOGO
制造商网址: http://sharp-world.com/
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PDF页面索引
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(Notice) ¡
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
(Internet) ¡Data for sharp's optoelectronic/power device is provided for internet.(Address http://www.sharp.co.jp/ecg/)
107
LT1W92A
Full Color Leadless Chip LED Device
LT1W92A
(Under Development)
Outline Dimensions
1.1
0.4
0.7
3.0
2.6
3.0
2.6
Colorless transparency
Black print
Recommended PWB pattern for soldering
Black print
0.4
(0.9)
(0.9)
(0.9)1.2
1.21.2
0.5
0.5
Soldering area
Device center
1.21.2
0.5
0.5
1.Plating area
Resist
2.Pin connections
3.Unspecified tolerance:±0.2
1 Anode(Blue)
2 Anode(Yellow-green)
3 Cathode
4 Anode(Red)
4 3
1 2
1 2
34
Radiation Diagram
80
40
20
60
-20˚ +20˚
+40˚
+60˚
+80˚
-40˚
-60˚
-80˚
80
100
100
40
20
60
-20˚ +20˚
+40˚
+60˚
+80˚
-40˚
-60˚
-80˚
Blue
Red
Yellow-green
X
X
[Anode] [Cathode]
Relative luminous intensity(%)
Relative luminous intensity(%)
DC Pulse
Model No.
Radiation color
Radiation material
Power dissipation
P
*1
(mW)
Forward current
IF
(mA)
Derating factor
(mA/˚C)
Peak forward current
IFM
*2
(mA)
Operating temperature
Topr
(˚C)
Storage temperature
Tstg
(˚C)
Soldering temperature
Tsol
*3
(˚C)
Reverse voltage
VR
(V)
( )
LT1W92A
GaN on SiC
GaP
GaAsP on GaP
200
84
84
30
30
30
100
50
50
0.67
0.40
0.40
1.33
0.67
0.67
5
5
5
260
260
260
Blue
Yellow-green
Red
-30 to +85
-30 to +85
-40 to +100
-40 to +100
-30 to +85 -40 to +100
*1 The value is specified under the condition that either color is lightened separately.
When all diodes are lightened simultaneously, the power dissipation of each diode should be less than 30% of the value specified in this table.
*2 Duty ratio=1/10, Pulse width=0.1ms
*3 For 3s or less at the temperature of hand soldering. Temperature of reflow soldering is shown on the below page.
Absolute Maximum Ratings
TYP MAX
Model No.
Lens
type
Forward voltage
VF(V)
λp(nm)
TYP
I
V(mcd)
TYP
I
F
(mA)
IF
(mA)
IF
(mA)
(MH
Z)
V
R
(V)
I
R(µA)
MAX
C
t(pF)
TYP
λ(nm)
TYP
Peak emission wavelength
Luminous intensity
Spectrum radiation bandwidth
Reverse current
Page for
characteristics
diagrams
Terminal capacitance
(Ta=25˚C)
Radiation
color
LT1W92A
4.4
2.1
2.0
5.6
2.8
2.8
430
565
635
20
20
20
8.1
32.0
16.0
20
20
20
70
30
35
20
20
20
10
10
10
4
4
4
50
35
20
1
1
1
----
----
----
Colorless
transparency
Blue
Yellow-green
Red
Electro-optical Characteristics
(Unit : mm) (Ta=25˚C)
3030 Size, 1.1mm Thickness, MID*
Type Full Color Leadless Chip
LED Device
*MID:Molded Interconnection Device
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