▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
◆Soldering
・ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
・ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
・ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
・ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
[Reflow soldering]
【Recommended conditions for eutectic
soldering】
Preheating
230℃
Within 10sec.
Slow cooling
60sec.
Min.
60sec
Min.
300
200
100
0
Temperature(℃)
【Recommended condition for Pb-free
soldering】
Peak
260℃ Max.
Within 10sec.
Slow
cooling
Heating above
230℃
40sec. Max.
300
200
100
0
Temperature(℃)
Preheating150℃
60sec. Min.
Caution
①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
1/2T~1/3T
PC board
Solder
Capacitor
T
[Wave soldering]
【Recommended conditions for eutectic
soldering】
230~250℃
Within 3sec.
Slow cooling
Preheating
120sec. Min.
300
200
100
0
Temperature(℃)
【Recommended condition for Pb-free
soldering】
Peak
260℃ Max.
Within 10sec.
Slow
cooling
120sec. Min.
300
200
100
0
Temperature(℃)
Preheating
150℃
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
[Hand soldering]
【Recommended conditions for eutectic
soldering】
230~280℃
Within 3sec.
Slow cooling
Preheating
60sec. Min.
400
200
100
0
Temperature(℃)
300
【Recommended condition for Pb-free
soldering】
Peak
350℃ Max.
Within 3sec.
Slow cooling
⊿T
400
200
100
0
Temperature(℃)
Preheating
150℃ Min.
60sec. Min.
300
⊿T
316type or less ⊿T≦150℃
Peak
280℃ Max.
Within 3sec.
Slow cooling
⊿T
400
200
100
0
温度(℃)
Preheating
150℃ Min.
60sec. Min.
300
⊿T
325type or more ⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. (e.g. to remove soldering flux or other materials from the production process.)
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
Technical
considerations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions( insufficient or excessive cleaning) may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output : 20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less