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LMK042B7102C-W

LMK042B7102C-W首页预览图
型号: LMK042B7102C-W
PDF文件:
  • LMK042B7102C-W PDF文件
  • LMK042B7102C-W PDF在线浏览
功能描述: Multilayer Ceramic Capacitors (High dielectric type)
PDF文件大小: 805.36 Kbytes
PDF页数: 共28页
制造商: TAIYO-YUDEN[Taiyo Yuden (U.S.A.), Inc]
制造商LOGO: TAIYO-YUDEN[Taiyo Yuden (U.S.A.), Inc] LOGO
制造商网址: http://www.t-yuden.com/
捡单宝LMK042B7102C-W
PDF页面索引
120%
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
(2)Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD and
leaded components
Lead wire of component
Solder-resist
Component placement close to
the chassis
Chassis
Solder (for grounding)
Electrode pattern
Solder-resist
Hand-soldering of leaded
components near mounted
components
Soldering iron
Lead wire of component
Solder-resist
Horizontal component
placement
Solder-resist
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical
stresses from board warp or deflection.
Items Not recommended Recommended
Deflection of board
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
C
A
B
Slit
Magnitude of stress A>B=C>D>E
Perforation
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
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