*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH6642MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6642MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6642MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMH6642MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMH6643MAX SOIC D 8 2500 367.0 367.0 35.0
LMH6643MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6644MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMH6644MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2