LMH6624
,
LMH6626
SNOSA42G –NOVEMBER 2002–REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
IN
Differential ±1.2 V
Supply voltage (V
+
- V
−
) 13.2 V
V
+
+0.5,
Voltage at Input pins V
V
−
−0.5
Input Current ±10 mA
Infrared or convection (20 sec.) 235 °C
Soldering information
Wave soldering (10 sec.) 260 °C
Junction temperature
(2)
150 °C
Storage temperature -65 150 °C
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Machine model
(2)
±200
(1) Human body model, 1.5 kΩ in series with 100 pF. JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a
standard ESD control process. Manufacturing with less than 2000-V HBM is possible with the necessary precautions. Pins listed as
±2000 V may actually have higher performance.
(2) Machine Model, 0 Ω in series with 200 pF. JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard
ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Operating temperature
(2)
−40 +125 °C
Operating supply voltage (V+ - V-) ±2.25 ±6.3 V
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
6.4 Thermal Information
LMH6624 LMH6626
THERMAL METRIC
(1)
DBV D DGK D UNIT
5 PINS 8 PINS 8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance
(2)
265 166 235 166 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of T
J(MAX)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ R
θJA
. All numbers apply for packages soldered directly onto a PC board.
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