LMC6062
SNOS631D –NOVEMBER 1994–REVISED MARCH 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Absolute Maximum Ratings
(1)(2)
Differential Input Voltage ±Supply Voltage
Voltage at Input/Output Pin (V
+
) +0.3V,
(V
−
) −0.3V
Supply Voltage (V
+
− V
−
) 16V
Output Short Circuit to V
+
See
(3)
Output Short Circuit to V
−
See
(4)
Lead Temperature (Soldering, 10 sec.) 260°C
Storage Temp. Range −65°C to +150°C
Junction Temperature 150°C
ESD Tolerance
(5)
2 kV
Current at Input Pin ±10 mA
Current at Output Pin ±30 mA
Current at Power Supply Pin 40 mA
Power Dissipation See
(6)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications
(3) Do not connect output to V
+
, when V
+
is greater than 13V or reliability witll be adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuos short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30 mA over long term may adversely
affect reliability.
(5) Human body model, 1.5 kΩ in series with 100 pF.
(6) The maximum power dissipation is a function of T
J(Max)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(Max)
− T
A
)/θ
JA
.
Operating Ratings
(1)
Temperature Range LMC6062AM −55°C ≤ T
J
≤ +125°C
LMC6062AI, LMC6082I −40°C ≤ T
J
≤ +85°C
Supply Voltage 4.5V ≤ V
+
≤ 15.5V
Thermal Resistance (θ
JA
)
(2)
8-Pin PDIP 115°C/W
8-Pin SOIC 193°C/W
Power Dissipation See
(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(2) All numbers apply for packages soldered directly into a PC board.
(3) For operating at elevated temperatures the device must be derated based on the thermal resistance θ
JA
with P
D
= (T
J
–T
A
)/θ
JA
.
DC Electrical Characteristics
(1)
Unless otherwise specified, all limits ensured for T
J
= 25°C. Boldface limits apply at the temperature extremes. V
+
= 5V, V
−
=
0V, V
CM
= 1.5V, V
O
= 2.5V and R
L
> 1M unless otherwise specified.
LMC6062AM LMC6062AI LMC6062I
Symbol Parameter Conditions Typ
(2)
Units
Limit
(3)
Limit
(3)
Limit
(3)
V
OS
Input Offset Voltage 100 350 350 800 μV
1200 900 1300 Max
(1) For ensured Military Temperature Range parameters, see RETSMC6062X.
(2) Typical values represent the most likely parametric norm.
(3) All limits are ensured by testing or statistical analysis.
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