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LM3S8530-IQR80-C1

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型号: LM3S8530-IQR80-C1
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  • LM3S8530-IQR80-C1 PDF文件
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功能描述: Stellaris® LM3S8530 Microcontroller
PDF文件大小: 4249.13 Kbytes
PDF页数: 共526页
制造商: TI[Texas Instruments]
制造商LOGO: TI[Texas Instruments] LOGO
制造商网址: http://www.ti.com
捡单宝LM3S8530-IQR80-C1
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120%
Table 1. Revision History (continued)
DescriptionRevisionDate
Corrected values for DSOSCSRC bit field in Deep Sleep Clock Configuration (DSLPCLKCFG)
register.
The FMA value for the FMPRE3 register was incorrect in the Flash Resident Registers table in the
Internal Memory chapter. The correct value is 0x0000.0006.
In the CAN chapter, major improvements were made including a rewrite of the conceptual information
and the addition of new figures to clarify how to use the Controller Area Network (CAN) module.
In the Ethernet chapter, major improvements were made including a rewrite of the conceptual
information and the addition of new figures to clarify how to use the Ethernet Controller interface.
4149October 2008
Added note on clearing interrupts to Interrupts chapter.
Added Power Architecture diagram to System Control chapter.
Additional minor data sheet clarifications and corrections.
3447August 2008
Corrected resistor value in ERBIAS signal description.
Additional minor data sheet clarifications and corrections.
3108July 2008
As noted in the PCN, three of the nine Ethernet LED configuration options are no longer supported:
TX Activity (0x2), RX Activity (0x3), and Collision (0x4). These values for the LED0 and LED1 bit
fields in the MR23 register are now marked as reserved.
As noted in the PCN, the option to provide VDD25 power from external sources was removed. Use
the LDO output as the source of VDD25 input.
As noted in the PCN, pin 41 (ball K3 on the BGA package) was renamed from GNDPHY to ERBIAS.
A 12.4-kΩ resistor should be connected between ERBIAS and ground to accommodate future device
revisions (see “Functional Description” on page 413).
Additional minor data sheet clarifications and corrections.
2972May 2008
2881April 2008 The Θ
JA
value was changed from 55.3 to 34 in the "Thermal Characteristics" table in the Operating
Characteristics chapter.
Bit 31 of the DC3 register was incorrectly described in prior versions of the data sheet. A reset of
1 indicates that an even CCP pin is present and can be used as a 32-KHz input clock.
Values for I
DD_HIBERNATE
were added to the "Detailed Power Specifications" table in the "Electrical
Characteristics" chapter.
The "Hibernation Module DC Electricals" table was added to the "Electrical Characteristics" chapter.
The maximum value on Core supply voltage (V
DD25
) in the "Maximum Ratings" table in the "Electrical
Characteristics" chapter was changed from 4 to 3.
The operational frequency of the internal 30-kHz oscillator clock source is 30 kHz ± 50% (prior data
sheets incorrectly noted it as 30 kHz ± 30%).
A value of 0x3 in bits 5:4 of the MISC register (OSCSRC) indicates the 30-KHz internal oscillator is
the input source for the oscillator. Prior data sheets incorrectly noted 0x3 as a reserved value.
The reset for bits 6:4 of the RCC2 register (OSCSRC2) is 0x1 (IOSC). Prior data sheets incorrectly
noted the reset was 0x0 (MOSC).
A note on high-current applications was added to the GPIO chapter:
For special high-current applications, the GPIO output buffers may be used with the following
restrictions. With the GPIO pins configured as 8-mA output drivers, a total of four GPIO outputs may
June 22, 201020
Texas Instruments-Production Data
Revision History
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