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Tabl e 3. PCB Layout guidelines
Table 4. Com ponen t list
The component list is sh ared in two secti ons: the firs t for the gener al-purpos e comp onent, the second for power
section:
GENERAL-PURPOSE SECTION
Goal Suggestion
Low radiation and low magnetic coupling
with the adjacent circuitry.
1) Small switching current loop areas. (For example placing C
IN
, High
Side and Low side MOSFETS, Shottky diode as close as possible).
2) Controller placed as close as possible to the power MOSFET.
3) Group the gate drive component (Boot cap and diode together near
the IC.
Don’t penalty the efficiency. Keep power traces and load connections short and wide.
Ensure high accuracy in the current sense
system.
Phase pin and PGND pin must be made with Kelvin connection and as
close as possible to the Low Side MOSFETS.
Reduce the noise effect on IC. 1) Put the feedback component (like output divider, integrator network,
etc) as close as possible to the IC.
2) The feedback traces must be parallel and as close as possible.
Moreover they must be routed as far as possible from the switching
current loops.
3) Make the controller ground connection like the figure 19.
Part name Value Dimension Notes
RESISTOR
R1 100Ω 0603 Output resistor divider for the
linear regulator.
R2 300Ω 0603
R3 560kΩ 0603 Input resistor divider
(To set switching frequency)
R4 33kΩ 0603
R5 47Ω 0603
R6, R7, R11, R12 33kΩ 0603
R8 47kΩ 0603 Current limit resistor
(To set current limit)
R9 390Ω 0603 Output resistor divider
(To set output volta ge)
R10 1KΩ 0603
R13 220Ω 0603
CAPACITOR
C1 220nF 0805
C2 47 µF KEMET-16V
C3 220nF 0805
C4 330pF 0603 First integrator capacitor
C5 47pF 0603
C6 10nF 0603
C7 N.M. 0603 Second integrator capacitor
C19 220nF 0805
C20 220nF 0603 Softstart capacitor
