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SERIES SPECIFICATIONS
Wattage
1
Oper. Voltage (V) Resistance TCR
2
VCR
2
Series Type P70 (mW) std. untrimmed (≥5%) Range Tolerance (ppm) (ppm)
HVC0805--- 0805 125 200 400 100K-100M 0.5-10% 25, 50, 100 100
>100M-1G 2-20% 50, 100, 250 250
>1G-10G 5-20% 250, 500 500
>10G-100G 10-30% 2000 1000
HVC1206--- 1206 250 600 1000 100K-100M 0.5-10% 25, 50, 100 50
>100M-1G 2-20% 50, 100, 250 100
>1G-10G 5-20% 100, 250 250
>10G-100G 10-30% 500, 1000 1000
HVC2512--- 2512 1000 2000 3000 100K-100M 0.5-10% 25, 50, 100 10
>100M-1G 1-20% 25, 50, 100 25
>1G-10G 2-20% 50, 100 50
>10G-100G 5-30% 250, 500 100
1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction.
2. Not all TCR/VCR combinations available in all resistance values
CHARACTERISTICS
Operating temperature
range
-55°C ~ +155°C
Climatic category
55/155/56, acc. to EN 60068-1
Solderability
250°C, 3s, acc. to EN 60068-2-58
Max. soldering temperature
260°C, 10s, acc. to IEC 68-2-58
Long Term Stability
<1G <10G ≥10G
Load Life 70°C/1000h <0.25% <0.5% <1%
Storage 125°C/1000h <0.5% <1% <2%
Max. Voltage/1000h <0.5% <1% <2%
Data not specified according to EN 140401-802 (CECC 40401-802)
HIGH
VOLTAGE
THICK FILM
SMD
HVC Series
Precision High-Value High-voltage Wraparound Chip
FEATURES
•Highvaluechipresistorsinthickfilmtechnology
•Lowtemperatureandvoltagedependency(lowTCRandVCR)
•Highworkingvoltageupto3000V
•Suitableforhighvacuumapplications—noorganics
•Contactareas:Nickel-barrier/mattetin
•Wraparoundterminals
100
Percent Rated Power
Ambient Temperature, °C
60
20
0
80
40
050 100 15570-55
Derating
TERMINAL DETAILS
Base Metal
PtAg
Termination Finish
100% electroplated matte Sn100
Thickness of Finish
5 microns
Barrier Material between Base Metal and Finish
Porosity-free Ni (5-8 microns thickness)
Baking/Annealing Process after Sn Plating
150°C; > 4 hours
Peak Process Body Temperature (Classification
Temperature) and Maximum Time
260°C for 10 seconds
