TLE
-
1
NO. PINS
PER ROW
-
01
-
PLATING
OPTION
-
DV
-
OPTION
02 thru 50 –G
= 10 µ" (0.25 µm)
Gold
–A
= Alignment Pin
(3 positions minimum)
–K
= (5.00 mm) .197" DIA
Polyimide Film Pick & Place Pad
(3 positions minimum)
–P
= Metal Pick & Place Pad
(4 positions minimum)
–TR
= Tape & Reel Packaging
(2-37 positions only)
-FR
= Full Reel Tape & Reel
(must order maximum
quantity per reel; contact
Samtec for quantity breaks)
(2-37 positions only)
CLT
-
1
NO. PINS
PER ROW
-
LEAD
STYLE
-
PLATING
OPTION
-
D
-
OTHER
OPTIONS
02 thru 50 –01
= Through-
hole
–02
= Surface
Mount
–03
= Through-
hole
–F
= Gold ash
on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–G
= 10 µ" (0.25 µm)
Gold on contact,
Gold ash on tail
All options require
Style –02
–BE
= Bottom Entry
(Required for bottom
entry applications)
–A
= Alignment Pin
(3 positions minimum)
Metal or plastic at
Samtec’s discretion
–K
= (5.00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
(04 thru 50 only)
–P
= Pick & Place Pad
(4 positions minimum)
(Not always necessary
for auto placement.)
–TR
= Tape & Reel
(36 positions max)
–FR
= Full Reel Tape & Reel
(must order maximum
quantity per reel;
contact Samtec for
quantity breaks)
(36 positions max)
SPECIFICATIONS
TLE
Mates:
TMMH, TMM, MTMM,
MMT, TW, LTMM, ZLTMM,
TCMD, TSH
CLT
Mates:
TMM, TMMH, MTMM,
MMT, TW, TSH
PROCESSING
TLE
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-26)
(0.15 mm) .006" max (27-50)*
*(.004" stencil solution
may be available; contact
ipg@samtec.com)
CLT
Same as TLE except:
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-34)*
(0.20 mm) .008" max (35-50)*
*(.004" stencil solution
may be available; contact
ipg@samtec.com)
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
TLE
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating (TLE/TMMH):
3.2 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
(2.08 mm) .082" to
(4.37 mm) .172" with
(0.38 mm) .015" wipe,
pass-through, or
(3.35 mm) .132" min
for bottom entry
CLT
Same as TLE except:
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Current Rating (TMMH/CLT):
4.1 A per pin
(2 pins powered)
Insertion Depth:
Top Entry=
(1.40 mm) .055" minimum
Bottom Entry=
(2.57 mm) .101" minimum
(add board thickness for
correct post OAL)
Max Cycles:
100 with 10 µ" (0.25 µm) Au
—P Option
–02
—A Option
Other Platings
(MOQ Required)
ALSO AVAILABLE
LEAD STYLE A
–01 (2.16) .085
–03 (2.95) .116
—P Option
—01 or —03
—A Option
COST-EFFECTIVE &
DUAL WIPE SOCKETS
(2.00 mm) .0787" PITCH • TLE/CLT SERIES
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specications which are subject to change without notice.
Gbps
(4.00)
.157
No. of positions x
(2.00) .0787
(2.13)
.084
(5.16)
.203
(2.27)
.090
(3.02)
.119
A
(4.32)
.170
(4.00)
.157
No. of positions x
(2.00) .0787
(5.51)
.217
(4.50)
.177
F-221