Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : December 07, 2017 (GMT)
CGJ3E2C0G1H822J080AA
TDK item description CGJ3E2C0G1H822JT****
Applications High Reliability Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series CGJ3(1608) [EIA 0603]
Status Production
Size
Length(L) 1.60mm ±0.10mm
Width(W) 0.80mm ±0.10mm
Thickness(T) 0.80mm ±0.10mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance 8.2nF ±5%
Rated Voltage 50VDC
Temperature Characteristic C0G(0±30ppm/°C)
Q (Min.) 1000
Insulation Resistance (Min.) 10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200 Yes
Packing Punched (Paper)Taping [180mm Reel]
Package Quantity 4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
