CD74FCT821A
BiCMOS 10-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCBS731 − JULY 2000
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol
†
6Q
18
7Q
17
8Q
16
9Q
15
10Q
14
7
6D
8
7D
9
8D
10
9D
EN
1
1Q
23
3
2D
4
3D
5
4D
6
5D
2Q
22
3Q
21
4Q
20
5Q
19
13
CLK
OE
11
10D
C1
1D
2
1D
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1D
OE
2
1
13
1Q
23
CLK
1D
To Nine Other Channels
C1
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
‡
DC supply voltage range, V
CC
−0.5 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC input clamp current, I
IK
(V
I
< −0.5 V) −20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output clamp current, I
OK
(V
O
< −0.5 V) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output sink current per output pin, I
OL
70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output source current per output pin, I
OH
−30 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
CC
, (I
CC
) 260 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through GND 500 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θ
JA
(see Note 1): EN package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M package 46°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.
