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AXE664124D

AXE664124D首页预览图
型号: AXE664124D
PDF文件:
  • AXE664124D PDF文件
  • AXE664124D PDF在线浏览
功能描述: Narrow pitch connectors
PDF文件大小: 622.99 Kbytes
PDF页数: 共13页
制造商: PANASONIC[Panasonic Semiconductor]
制造商LOGO: PANASONIC[Panasonic Semiconductor] LOGO
制造商网址: http://www.panasonic.com/industrial/
捡单宝AXE664124D
PDF页面索引
120%
Narrow pitch connectors A4S (0.4 mm pitch)
Panasonic Corporation Electromechanical Control Business Division
industrial.panasonic.com/ac/e/
ACCTB7E 202003
Panasonic Corporation 2020
Material and surface treatment
Part name Material Surface treatment
Molded portion LCP resin (UL
94
V-
0
)
Contact and Post Copper alloy
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers
(exposed nickel portions).
Soldering terminals Copper alloy
Sockets:
Base: Ni plating, Surface: Pd + Au ash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Characteristics
Item Specications Conditions
Electrical
characteristics
Rated current
0
.
3
A/pin contact (Max.
5
A at total pin contacts)
Rated voltage
60
V AC/DC
Dielectric strength
150
V AC for
1
min.
No short-circuiting or damage at a detection current of
1
mA when the specied voltage is applied for one minute.
Insulation resistance Min.
1
,
000
MΩ (initial) Using
250
V DC megger (applied for
1
min.)
Contact resistance Max.
90
Based on the contact resistance measurement method
specied by JIS C
5402
.
Mechanical
characteristics
Composite insertion
force
Max.
1
.
200
N/pin contact × pin contacts (initial)
Composite removal
force
Min.
0
.
165
N/pin contact × pin contacts
Environmental
characteristics
Ambient temperature
55
to +
85
°C No icing. No condensation.
Soldering heat
resistance
The initial specication must be satised electrically
and mechanically.
Reow soldering:
Peak temperature:
260
°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron:
300
°C within
5
sec.
350
°C within
3
sec.
Storage temperature
55
to +
85
°C (product only)
40
to +
50
°C (emboss packing)
No icing. No condensation.
Thermal shock
resistance
(header and socket
mated)
5
cycles,
insulation resistance Min.
100
MΩ,
contact resistance Max.
90
Temperature (
)Order Time (minutes)
1
2
3
4
30
Max.
5
30
Max.
5
Conformed to MIL-STD-
202
F, method
107
G
+
3
0
55
85
55
0
3
0
3
Humidity resistance
(header and socket
mated)
120
hours,
insulation resistance Min.
100
MΩ,
contact resistance Max.
90
Conformed to IEC60068-
2
-
78
Temperature
40
±
2
°C, humidity
90
to
95
% RH
Saltwater spray
resistance
(header and socket
mated)
24
hours,
insulation resistance Min.
100
MΩ,
contact resistance Max.
90
Conformed to IEC60068-
2
-
11
Temperature
35
±
2
°C, saltwater concentration
5
±
1
%
H
2
S resistance (header
and socket mated)
48
hours,
contact resistance Max.
90
Temperature
40
±
2
°C, gas concentration
3
±
1
ppm,
humidity
75
to
80
% RH
Lifetime
characteristics
Insertion and removal
life
30
times
Repeated insertion and removal speed of Max.
200
times/hour
Unit weight
20
pins Socket:
0
.
02
g Header:
0
.
01
g
SPECIFICATIONS
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