Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/
AXE5, 6
ACCTB7E 201303-T
SPECIFICATIONS
Characteristics
Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/pin contact (Max. 5 A at total pin contacts)
Rated voltage 60V AC/DC
Breakdown voltage 150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩ
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 1.200N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.165N/pin contacts × pin contacts
Contact holding force
(Socket contact)
Min. 0.20N/pin contacts
Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures. No dew condensation.
Soldering heat resistance
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No freezing at low temperatures. No dew condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Bath temperature 35±2°C,
saltwater concentration 5±1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Insertion and removal life 30 times
Repeated insertion and removal speed of max. 200 times/
hours
Unit weight 20 pin contact type: Socket: 0.02 g Header: 0.01 g
Part name Material Surface treatment
Molded
portion
LCP resin
(UL94V-0)
—
Contact and
Post
Copper alloy
Contact portion:
Base: Ni plating Surface: Au plating
Te r minal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3
