Package Type
28D6 28 Lead, 0.6 00 " Wi de , Non -Wi nd owe d, Ceramic Dual Inlin e Pac ka ge (Cerdi p)
28F 28 Lead, Non-Windo wed , Cera mi c Bot to m-Bra ze d Fl at Pa ckag e (Fl atpack )
32J 32 Lead, Plasti c J-L ea de d Chi p Carri er (PLCC)
32L 32 Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)
28P6 28 Lead, 0.6 00 " Wide , Pla stic Dual Inl in e Packa ge (PDIP)
28S 28 Lead, 0.300" Wide, Pla st ic Gull Wing Small Outl ine (SOIC)
28T 28 Lead, Plastic Th in Small Out line Package (TSOP)
28U 2 8 Pin, Ceramic Pin Grid Array (PGA)
W Die
Options
Blank Standard Device : End urance = 10 K Wr it e Cyc les; Write Time = 10 ms
E High Endurance Option: Endurance = 100K Write Cycles
F Fast Write Optio n: Write Time = 3 ms
2-230 AT28C256