AUSTIN SEMICONDUCTOR, INC.
FLASHFLASH
FLASHFLASH
FLASH
AS8FLC2M32
AS8FLC2M32B
Rev. 1.2 5/09
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
1
Austin Semiconductor, Inc.
FIGURE 1: PIN ASSIGNMENT
(Top View)
Hermetic, Multi-Chip Module
(MCM)
64Mb, 2M x 32, 3.3Volt Boot Block FLASH
Array
Available via Applicable Specifications:
• MIL-PRF-38534, Class H
FEATURES
• 64Mb device, total density, organized as 2M x 32
• Bottom Boot Block (Sector) Architecture
(Contact factory for top boot)
• Operation with single 3.0V Supply
• Available in multiple Access time variations
• Individual byte control via individual byte selects (CSx\)
• Low Power CMOS
• 1,000,000 Erase/Program Cycles
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Sector Architecture:
• One 16K byte, two 8K byte, one 32K byte and
thirty-one 64Kbyte sectors (byte mode)
• Any combination of sectors can be concurrently erased
• MCM supports full array (multi-chip) Erase
• Embedded Erase and Program Algorithms
• Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
• TTL Compatible Inputs and Outputs
• Military and Industrial operating temperature ranges
OPTION MARKING
Access Speed
70ns -70
90ns -90
100ns -100
120ns -120
Package
Ceramic Quad Flat Pack Q
Ceramic Hex Inline Pack P
Temperature Range
Full Mil (MIL-PRF-38534, Class H) /Q
Military Temp (-55
o
C to +125
o
C) /XT
Industrial (-40
o
C to +85
o
C) /IT
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8FLC2M32B is a 64Mb
FLASH Multi-Chip Module organized as 2M x 32 bits. The
module achieves high speed access, low power consumption
and high reliability by employing advanced CMOS memory
technology. The military grade product is manufactured in
compliance to the MIL-PRF-38534 specifications, making the
AS8FLC2M32B ideally suited for military or space applications.
The module is offered in a 68-lead 0.990 inch square ceramic
quad flat pack or 66-lead 1.185inch square ceramic Hex In-line
Package (HIP). The CQFP package design is targeted for those
applications, which require low profile SMT Packaging.
For more products and information
please visit our web site at
www.austinsemiconductor.com
I/O0
I/O1
I/02
I/O5
I/O6
I/O7
GND
I/O10
I/O11
I/O17
I/O18
I/O21
I/O22
I/O23
GND
I/O26
I/O27
I/O16
I/O19
I/O25
I/O20
I/O24
I/O28
I/O30
I/O29
I/O 3
I/O 9
I/O4
I/O8
10
11
12
13
14
15
16
17
18
09
08
07
06
05
04
03
02
01
68
67
66
65
64
63
62
61
60
59
78
57
76
55
54
53
52
51
50
49
48
47
46
45
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
I/012
I/O 14
I/O13
25
24
23
22
21
19
20
VCC
A10
A8
A7
A6
WE1\
CS4\
GND
CS3\
A5
A4
A3
A2
A1
A0
A9
RESET\VCC
A11
A12
A13
A14
A15
CS1\
OE\
CS2\
A17
WE2\
WE3\
WE4\
A18
A19
NC
A16
26 44
I/O 15
I/O 31
[Package Designator QT]
I/O2
I/O1
I/O0
I/O8
I/O9
I/O10
I/O4I/O3
I/O5
I/O6
I/O7
I/O11
I/O12
I/O13
I/O14
I/O15
I/O16
I/O17
I/O18 I/O19 I/O20
I/O21
I/O22
I/O23
I/O24
I/O25
I/O26
I/O27 I/O28
I/O29
I/O30
I/O31
A0
A18
A11
A16
A14
A15
A9
A10
A17
A8
A7
A4
A5
A6
A1
A2
A3
A12
A13
NC
NC
CS3\
CS2\
CS1\
CS4\
A19
VCC
VCC
GND
GND
Reset\
OE\
WE\
NC
66 HIP
Pin Assignment
[Package Designator H]
(Top View)
P
DQ8
DQ9
DQ10
DQ0
DQ1
DQ2
DQ11
DQ3
DQ15
DQ14
DQ13
A20
DQ12
DQ7
DQ6
DQ5
DQ4
DQ24
DQ25
DQ26
DQ27
DQ31
DQ30
DQ29
DQ19
DQ28
DQ23
DQ22
DQ21
DQ20
DQ16
DQ17
DQ18
DQ25
DQ24
DQ23
DQ22
DQ21
DQ20
DQ19
DQ18
DQ17
DQ16
DQ31
DQ30
DQ29
DQ28
DQ27
DQ26
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
A20
