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AMC1200SDUBR

AMC1200SDUBR首页预览图
型号: AMC1200SDUBR
PDF文件:
  • AMC1200SDUBR PDF文件
  • AMC1200SDUBR PDF在线浏览
功能描述: Fully-Differential Isolation Amplifier Low Offset Error: 1.5 mV max
PDF文件大小: 488.89 Kbytes
PDF页数: 共22页
制造商: TI1[Texas Instruments]
制造商LOGO: TI1[Texas Instruments] LOGO
制造商网址: http://www.ti.com
捡单宝AMC1200SDUBR
PDF页面索引
120%
AMC1200
www.ti.com
SBAS542 APRIL 2011
IEC 60747-5-2 INSULATION CHARACTERISTICS
Over operating free-air temperature range (unless otherwise noted).
PARAMETER TEST CONDITIONS VALUE UNIT
V
IORM
Maximum working insulation voltage 1200 V
PEAK
Qualification test: after Input/Output Safety Test
Subgroup 2/3 V
PR
= V
IORM
x 1.2, t = 10 s, partial 1140 V
PEAK
discharge < 5 pC
Qualification test: method a, after environmental tests
V
PR
Input to output test voltage
subgroup 1, V
PR
= V
IORM
x 1.6, t = 10 s, partial discharge 1920 V
PEAK
< 5 pC
100% production test: method b1, V
PR
= V
IORM
x 1.875,
2250 V
PEAK
t = 1 s, partial discharge < 5 pC
V
IOTM
Transient overvoltage Qualification test: t = 60 s 4000 V
PEAK
Qualification test: V
TEST
= V
ISO
, t = 60 s 4000 V
PEAK
V
ISO
Insulation voltage per UL
100% production test: V
TEST
= 1.2 x V
ISO
, t = 1 s 4800 V
PEAK
R
S
Insulation resistance V
IO
= 500 V at T
S
> 10
9
Ω
PD Pollution degree 2 °
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A
failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient
power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of
a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and
is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then
the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
S
Safety input, output, or supply current θ
JA
= 246°C/W, V
IN
= 5.5 V, T
J
= +150°C, T
A
= +25°C 10 mA
T
C
Maximum case temperature +150 °C
IEC 61000-4-5 RATINGS
PARAMETER TEST CONDITIONS VALUE UNIT
V
IOSM
Surge immunity 1.2-μs/50-μs voltage surge and 8-μs/20-μs current surge ±4000 V
IEC 60664-1 RATINGS
PARAMETER TEST CONDITIONS SPECIFICATION
Basic isolation group Material group II
Rated mains voltage 150 V
RMS
I-IV
Rated mains voltage 300 V
RMS
I-IV
Installation classification
Rated mains voltage 400 V
RMS
I-III
Rated mains voltage < 600 V
RMS
I-III
Copyright © 2011, Texas Instruments Incorporated 3
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