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PACKAGE OUTLINE
C
1.298 MAX
TYP
0.36
0.26
15.6
TYP
15.6 TYP
0.65 TYP
0.65 TYP
538X
0.47
0.37
(0.378)
A
17.1
16.9
B
17.1
16.9
(0.7) TYP
( 14)
(0.7) TYP
4X (R )1
FCBGA - 1.298 mm max heightCBD0538A
BALL GRID ARRAY
4222967/A 04/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
BALL A1 CORNER
SEATING PLANE
BALL TYP
0.1 C
NOTE 4
A
C
E
G
J
L
N
R
U
W
AA
AC
AE
1
2
3
0.15 C A B
0.08 C
SYMM
SYMM
4
NOTE 3
5
6
7
8
9
10
11
12
13
14
15
16
17
19
21
23
25
18
20
22
24
B
D
F
H
K
M
P
T
V
Y
AB
AD
SCALE 0.800