xi_oscj
vssa_oscj
Device
xo_oscj
C
f1
Crystal
Rd
C
f2
(Optional)
SPRS906_PCB_CLK_OSC_03
380
AM5706, AM5708
SPRS961B –AUGUST 2016–REVISED SEPTEMBER 2017
www.ti.com
Submit Documentation Feedback
Product Folder Links: AM5706 AM5708
Applications, Implementation, and Layout Copyright © 2016–2017, Texas Instruments Incorporated
Table 7-14. LJCB_REFN/P Requirements in External LVDS REFCLK Mode
PARAMETER MIN TYP MAX UNIT
ljcb_clkn / ljcb_clkp AC coupling capacitor value 100 nF
ljcb_clkn / ljcb_clkp AC coupling capacitor package size 0402 0603 EIA
(1) EIA LxW units, i.e., a 0402 is a 40x20 mils surface mount capacitor.
(2) The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair placed side by side.
Table 7-15. LJCB_REFN/P Requirements in Output REFCLK Mode
PARAMETER MIN TYP MAX UNIT
ljcb_clkn / ljcb_clkp near-side termination to ground value 47.5 50 52.5 Ohms
7.8 Clock Routing Guidelines
7.8.1 Oscillator Ground Connection
Although the impedance of a ground plane is low it is, of course, not zero. Therefore, any noise current in
the ground plane causes a voltage drop in the ground.
Figure 7-31 shows the grounding scheme for high-frequency clock.
(1) j in *_osc = 0 or 1
Figure 7-31. Grounding Scheme for High-Frequency Clock
