6 Am29LV800B
PRELIMINARY
Special Handling Instructions for FBGA
Package
Special handling is required f or Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be
compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of
time.
PIN CONFIGURATION
A0–A18 = 19 addresses
DQ0–DQ14 = 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/outpu t, word mode),
A-1 (LSB address input, byte mode)
BYTE# = Selects 8-bit or 16-bit mode
CE# = Chip enable
OE# = Output enable
WE# = Write enable
RESET# = Hardware reset pin, active low
RY/BY# = Ready/Busy# output
V
CC
= 3.0 volt-only single power supply
(see Product Selector Guide for speed
options and vo ltage s upply toler anc es)
V
SS
= De vice ground
NC = Pin not connected internally
LOGIC SYMBOL
21490E-4
19
16 or 8
DQ0–DQ15
(A-1)
A0–A18
CE#
OE#
WE#
RESET#
BYTE# R Y/BY#