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AM29DL320GB50PCIN

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型号: AM29DL320GB50PCIN
PDF文件:
  • AM29DL320GB50PCIN PDF文件
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功能描述: 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory
PDF文件大小: 1185.79 Kbytes
PDF页数: 共58页
制造商: AMD[Advanced Micro Devices]
制造商LOGO: AMD[Advanced Micro Devices] LOGO
制造商网址: http://www.amd.com
捡单宝AM29DL320GB50PCIN
PDF页面索引
120%
Am29DL320G 3
TABLE OF CONTENTS
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Special Package Handling Instructions ..........................................6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 1. Device Bus Operations .............................................................9
Word/Byte Configuration ................................................................ 9
Requirements for Reading Array Data ...........................................9
Writing Commands/Command Sequences ..................................10
Simultaneous Read/Write Operations
with Zero Latency .........................................................................10
Standby Mode .............................................................................. 10
Automatic Sleep Mode .................................................................10
RESET#: Hardware Reset Pin .....................................................11
Output Disable Mode ...................................................................11
Table 2. Top Boot Sector Addresses ...................................................12
Table 3. Top Boot SecSi
TM
Sector Addresse s .............. ... .................... 13
Table 4. Bottom Boot Sector Addresses ...............................................14
Table 5. Bottom Boot SecSi
TM
Sector Addres se s................................ 15
Autoselect Mode .......................................................................... 16
Table 6. Autoselect Codes, (High Voltage Method) .............................16
Sector/Sector Block Protection and Unprotection ........................ 17
Table 7. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................17
Table 8. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................17
Write Protect (WP#) .....................................................................18
Temporary Sector Unprotect ........................................................18
Figure 1. Temporary Sector Unprotect Operation................................. 18
Figure 2. In- System Sector Protection/
Sector Unprote ctio n Algorith m s ....... ... ............................................. ..... 19
SecSi
TM
(Secured Silicon) Sector
Flash Memory Region ..................................................................20
Figure 3. SecSi Sector Pro te ct Verif y........... ... ........................ .............. 21
Hardware Data Protection ............................................................21
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 9. CFI Query Identification String................................................ 22
Table 10. System Interface String......................................................... 22
Table 11. Device Geometry Definition .................................................. 23
Table 12. Primary Vendor-Specific Extended Query ............................ 23
Reading Array Data ......................................................................24
Reset Command ..........................................................................24
Autoselect Command Sequence ..................................................24
Enter SecSi
TM
Sector/Exit SecSi Sector
Command Sequence ...................................................................25
Byte/Word Program Command Sequence ...................................25
Figure 4. Program Operation ................................................................ 26
Chip Erase Command Sequence .................................................26
Sector Erase Command Sequence ..............................................26
Erase Suspend/Erase Resume Commands ................................27
Figure 5. Erase Operation .................................................................... 27
Table 13. Comman d De fin itio ns .... ... ... ................................................. 28
DQ7: Data# Polling ......................................................................29
Figure 6. Data# Polling Algorithm......................................................... 29
RY/BY#: Ready/Busy# ................................................................. 30
DQ6: Toggle Bit I ..........................................................................30
Figure 7. Toggle Bit Algorithm .............................................................. 30
DQ2: Toggle Bit II .........................................................................31
Reading Toggle Bits DQ6/DQ2 ....................................................31
DQ5: Exceeded Timing Limits ......................................................31
DQ3: Sector Erase Timer .............................................................31
Table 14. Write Opera tio n Stat us .......... .......................................... ... ..32
Figure 8. Maximum Negative Overshoot Waveform............................. 33
Figure 9. Maximum Positive Overshoot Waveform .............................. 33
Figure 10. I
CC1
Current vs. Time (Showing Active and
Automatic Sleep Currents).................................................................... 35
Figure 11. Typical I
CC1
vs. Frequency................................................... 35
Figure 12. Test Setup .......................................................................... 36
Figure 13. Input Waveforms and Measurement Levels........................ 36
Figure 14. Read Operation Timings...................................................... 37
Figure 15. Reset Timings...................................................................... 38
Word/Byte Configuration (BYTE#) ...............................................39
Figure 16. BYTE# Timings for Read Operations .................................. 39
Figure 17. BYTE# Timings for Write Operations .................................. 39
Erase and Program Operations ...................................................40
Figure 18. Program Operation Timings ................................................ 41
Figure 19. Accelerated Program Timing Diagram ................................ 41
Figure 20. Chip/Sector Erase Operation Timings................................. 42
Figure 21. Back-to-back Read/Write Cycle Timings............................. 43
Figure 22. Data# Polling Timings (During Embedded Algorithms) ....... 43
Figure 23. Toggle Bit Timings (During Embedded Algorithms) ............ 44
Figure 24. DQ2 vs. DQ6 ....................................................................... 44
Temporary Sector Unprotect ........................................................45
Figure 25. Temporary Sector Unprotect Timing Diagram..................... 45
Figure 26. Sector/Sec tor Block Protect and Unprotect Timing Diagram 46
Alternate CE# Controlled Erase and Program Operations ...........47
Figure 27. Alternate CE# Controlled Write (Erase/Program)
Operation Timings ................................................................................ 48
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 14 mm .50
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm .........................51
TS 048—Thin Small Outline Package ..........................................52
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