Package Pin Assignments
4-18 Revision 17
QN68
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle of the package is tied to ground (GND).
Pin A1 Mark
1
68