Fusion Family of Mixed Signal FPGAs
Revision 4 4-3
QN180
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/default.aspx.
Note: The die attach paddle center of the package is tied to ground (GND).
A1
B1
C1
A16
B15
C14
A48
Pin A1 Mark
Optional Corner
Pad (4X)
A49
A64
A32 A17
B45
B46
B60
B30
B16
C42
C43
C56
C28
C15
A33
B31
C29
D4
D3
D1
D2