DC and Power Characteristics
3-22 Revision 4
Dynamic Power Consumption of Various Internal Resources
Table 3-14 • Different Components Contributing to the Dynamic Power Consumption in Fusion Devices
Parameter Definition
Power Supply
Device-Specific
Dynamic Contributions
UnitsName Setting AFS1500 AFS600 AFS250 AFS090
PAC1 Clock contribution of a Global
Rib
VCC 1.5 V 14.5 12.8 11 11 µW/MHz
PAC2 Clock contribution of a Global
Spine
VCC 1.5 V 2.5 1.9 1.6 0.8 µW/MHz
PAC3 Clock contribution of a VersaTile
row
VCC 1.5 V 0.81 µW/MHz
PAC4 Clock contribution of a VersaTile
used as a sequential module
VCC 1.5 V 0.11 µW/MHz
PAC5 First contribution of a VersaTile
used as a sequential module
VCC 1.5 V 0.07 µW/MHz
PAC6 Second contribution of a
VersaTile used as a sequential
module
VCC 1.5 V 0.29 µW/MHz
PAC7 Contribution of a VersaTile used
as a combinatorial module
VCC 1.5 V 0.29 µW/MHz
PAC8 Average contribution of a routing
net
VCC 1.5 V 0.70 µW/MHz
PAC9 Contribution of an I/O input pin
(standard dependent)
VCCI See Table 3-12 on page 3-18
PAC10 Contribution of an I/O output pin
(standard dependent)
VCCI See Table 3-13 on page 3-20
PAC11 Average contribution of a RAM
block during a read operation
VCC 1.5 V 25 µW/MHz
PAC12 Average contribution of a RAM
block during a write operation
VCC 1.5 V 30 µW/MHz
PAC13 Dynamic Contribution for PLL VCC 1.5 V 2.6 µW/MHz
PAC15 Contribution of NVM block during
a read operation (F < 33MHz)
VCC 1.5 V 358 µW/MHz
PAC16 1st contribution of NVM block
during a read operation (F > 33
MHz)
VCC 1.5 V 12.88 mW
PAC17 2nd contribution of NVM block
during a read operation (F > 33
MHz)
VCC 1.5 V 4.8 µW/MHz
PAC18 Crystal Oscillator contribution VCC33A 3.3 V 0.63 mW
PAC19 RC Oscillator contribution VCC33A 3.3 V 3.3 mW
PAC20 Analog Block dynamic power
contribution of ADC
VCC 1.5 V 3 mW