122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Electrical Test not required
Magnification 50X
SMD conditions:
1
st
step: method B, aging 4 hours at 155 °C
dry heat
2
nd
step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
Well tinned (≥95% covered)
No visible damage
Leadfree solder, 260 °C, 30 seconds
immersion time
- Resistance to
Soldering Heat
IEC 60115-1 4.18
MIL-STD-202 Method 215
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (1%+0.05Ω)
<50 mΩ for Jumper
No visible damage
Sulfur 750 hours, 105℃, unpowered
± (4.0%+0.05Ω)
<100mΩ for Jumper
