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AF122-JR-071KL

AF122-JR-071KL首页预览图
型号: AF122-JR-071KL
PDF文件:
  • AF122-JR-071KL PDF文件
  • AF122-JR-071KL PDF在线浏览
功能描述: ANTI-SULFURATED CHIP RESISTORS
PDF文件大小: 560.43 Kbytes
PDF页数: 共8页
制造商: YAGEO[YAGEO Corporation]
制造商LOGO: YAGEO[YAGEO Corporation] LOGO
制造商网址: http://www.yageo.com
捡单宝AF122-JR-071KL
PDF页面索引
120%
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
6
8
www.yageo.com
Mar. 20, 2017 V.5
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Life/
Endurance
MIL-STD-202-method 108
IEC 60115-1 4.25
1,000 hours at 70± 2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (2%+0.05 Ω )
<100 mΩ for Jumper
High Temperature
Exposure
MIL-STD-202-method 108
1,000 hours at maximum operating
temperature depending on specification,
unpowered
Tolerances: 155± 3 °C
± (1%+0.05 Ω)
<50 mΩ for Jumper
Moisture
Resistance
MIL-STD-202-method 106
Each temperature / humidity cycle is defined at
8 hours (method 106G), 3 cycles / 24 hours
for 10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24± 2 hours after
test conclusion
± (2%+0.05 Ω)
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202-method 107
-55/+125 °C
Note: Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air Air
± (1%+0.05 Ω)
<50 mΩ for Jumper
Short Time
Overload
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
± (2%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as
described, only 1 board bending required
3 mm bending
Bending time: 60± 5 seconds
Ohmic value checked during bending
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Table 4 Test condition, procedure and requirements
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