ADT7481
http://onsemi.com
2
Figure 1. Functional Block Diagram
11−BIT A−TO−D
CONVERTER
RUN/STANDBYBUSY
REMOTE 1 AND 2 TEMP
OFFSET REGISTERS
DIGITAL MUX
LIMIT COMPARATOR
STATUS REGISTERS
INTERRUPT
MASKING
CONFIGURATION
REGISTERS
REMOTE 1 AND 2 TEMP
HIGH LIMIT REGISTERS
REMOTE 1 AND 2 TEMP
LOW LIMIT REGISTERS
REMOTE 1 AND 2 TEMP
THERM LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
THERM LIMIT REGISTER
ONE−SHOT
REGISTER
ADDRESS POINTER
REGISTER
CONVERSION RATE
REGISTER
REMOTE 1 AND 2 TEMP
VALUE REGISTERS
LOCAL TEMPERATURE
VALUE REGISTER
ON−CHIP TEMP
SENSOR
ANALOG
MUX
EXTERNAL DIODES OPEN−CIRCUIT
SMBUS INTERFACE
ADT7481
7
8
3
2
10 41 69
V
DD
GND SDATA SCLK
THERM
8
D1+
D1–
D2+
D2–
ALERT/THERM2
ABSOLUTE MAXIMUM RATINGS
Parameter Rating Unit
Positive Supply Voltage (V
DD
) to GND −0.3 to +3.6 V
D+ −0.3 to V
DD
+ 0.3 V
D− to GND −0.3 to +0.6 V
SCLK, SDATA, ALERT, THERM
−0.3 to +3.6
V
Input Current, SDATA, THERM −1 to +50 mA
Input Current, D− ±1 mA
ESD Rating, All Pins (Human Body Model) 1500 V
Maximum Junction Temperature (T
J
max) 150 °C
Storage Temperature Range −65 to +150 °C
IR Reflow Peak Temperature 220 °C
IR Reflow Peak Temperature for Pb−Free 260 °C
Lead Temperature, Soldering (10 sec) 300 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
THERMAL CHARACTERISTICS
Package Type
q
JA
q
JC
Unit
10−Lead MSOP 142 43.74 °C/W