Data Sheet ADIS16375
Rev. E | Page 27 of 28
APPLICATIONS INFORMATION
MOUNTING TIPS
For best performance, follow these simple rules when installing
the ADIS16375 into a system.
1. Eliminate opportunity for translational force (x-axis and
y-axis direction; see Figure 6).
2. Isolate mounting force to the four corners, on the part of
the package surface that surrounds the mounting holes.
3. Use uniform mounting forces on all four corners. The
suggested torque setting is 40 inch-ounces (0.285 N-m).
These three rules help prevent nonuniform force profiles, which
can warp the package and introduce bias errors in the sensors.
Figure 23 provides an example that leverages washers to set the
package off the mounting surface and uses 2.85 mm pass through
holes and backside washers/nuts for attachment. Figure 24 and
Figure 25 provide some details from mounting hole and connector
alignment pin drill locations. For more information on mounting
the ADIS16375, see the AN-1295 Application Note.
MOUNTING SCREWS
M2 × 0. 4mm, 4×
WASHE RS ( OPT IONAL)
M2, 4×
ADIS16375
WASHE RS ( OPT IONAL)
M2, 4×
NUTS
M2 × 0. 4mm, 4×
MATING CONNECT OR
CLM-112-02
PCB
PASS THROUGH HOLES
DIAMETER ≥ 2.85mm
SPACERS/WASHERS
SUGGESTED, 4×
09389-123
Figure 23. Mounting Example
0.560 BSC 2×
ALIGNMENT HOLES
FOR MATING SOCKET
PASS THRO UGH HOLE
FO R M OUNT ING S CRE WS
DIAMETER OF THE HOLE
MUST ACCOMM ODATE
DIME NS IO NAL TOL E RANCE
BETWEE N THE CO NNE CTO R
AND HOL E S .
19.800 BSC
39.600 BSC
42.600
21.300 BSC
5 BSC5 BSC
1.642 BSC
NOTES
1. AL L DI M E NS IONS IN mm UNI TS.
2. T HE CONNECTOR FACES DOWN AND ARE NOT V ISI BLE FROM THI S V IEW.
ADIS16375
OUTLINE
09389-124
Figure 24. Suggested PCB Layout Pattern, Connector Down
0.4334 [11.0]
0.0240 [0.610]
0.019685
[0.5000]
(TYP)
0.054 [1.37]
0.0394 [1.00]
0.0394 [1.00]
0.1800
[4.57]
NONPLATED
THRO UGH HO LE 2×
0.022± DIA (TYP)
0.022 DI A THRO UGH HO LE ( TYP )
NONPLAT E D THRO UGH HO LE
09389-125
Figure 25. Suggested Layout and Mechanical Design when Using the Samtec
CLM-112-02-G-D-A for the Mating Connector
EVALUATION TOOLS
Breakout Board, ADIS16IMU/PCBZ
The ADIS16IMU1/PCBZ (sold separately) provides a breakout
board function for the ADIS16375, which means that it provides
access to the ADIS16375 through larger connectors that support
standard 1 mm ribbon cabling. It also provides four mounting
holes for attachment of the ADIS16375 to the breakout board.
For more information on the ADIS16IMU1/PCBZ, see
www.analog.com/ADIS16IMU1/PCBZ.
PC-Based Evaluation, EVAL-ADIS2
Use the E VA L -ADIS2 and the ADIS16IMU1/PCBZ to evaluate
the ADIS16375 on a PC-based platform.
POWER SUPPLY CONSIDERATIONS
The ADIS16375 has approximately ~24 µF of capacitance across
the VDD and GND pins. While this capacitor bank provides a
large amount of localized filtering, it also presents an opportunity
for excessive charging current when the VDD voltage ramps too
quickly. Use the following relationship to help determine the
appropriate VDD voltage profile, with respect to any current
limit functions that can cause the power supply to lose regulation
and potentially introduce unsafe conditions for the ADIS16375.
In addition to managing the initial voltage ramp, the ADIS16375
has transient current demands during its start-up period, with
the peak current reaching 1500 mA for a period of 400 μs.
X-RAY SENSITIVITY
Exposure to high dose rate X-rays, such as those in production
systems that inspect solder joints in electronic assemblies, may
affect accelerometer bias errors. For optimal performance, avoid
exposing the ADIS16375 to this type of inspection.