Surface-Mount Ceramic Multilayer Capacitors
SOLDERING CONDITIONS
The lead free MLCCs are able to stand the reflow soldering conditions as below:
Temperature: above 220 °C
Endurance: 95 to 120 seconds
Cycles: 3 times
The test of "soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202F-method 210F", "The robust
construction of chip capacitors allows them to be completely immersed in a solder bath of 270 °C for 10 seconds". Therefore, it is possible
to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested
for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds.
The capacitors may be mounted on printed-circuit boards or
ceramic substrates
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 V
rms
at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 V
rms
at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 V
rms
at 20 °C
Within specified tolerance
Dissipation
Factor (D.F.)
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 V
rms
at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 V
rms
at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 V
rms
at 20 °C
In accordance with
specification
In accordance with
specification
Table 16 Test procedures and requirements