Surface-Mount Ceramic Multilayer Capacitors
Electrical
Characterization
Parametrically test per lot and sample size requirements,
summary to show Min, Max, Mean and Standard deviation at
room as well as Min and Max operating temperatures.
∆C/C
Class 1:
NP0: ± 30 ppm/°C
Class2:
X7R: ± 15%
Class 1:
NP0: -55 °C to +125 °C
Normal temperature: 20 °C
Class 2:
X7R: -55 °C to +125 °C
Normal temperature: 20 °C
Part mounted on a 100 mm X 40 mm FR4 PCB board, which
is 1.6 ± 0.2 mm thick and has a layer-thickness 35 µm ± 10
µm.
Part should be mounted using the following soldering reflow
profile.
Conditions:
Class1:
Bending 3 mm at a rate of 1 mm/s, radius jig 340 mm
Class2:
Bending 2 mm at a rate of 1 mm/s, radius jig 340 mm
Test Substrate:
∆C/C
Class1:
NP0: Within ± 1% or 0.5 pF,
whichever is greater
Class2:
X7R: ± 10%
With the component mounted on a PCB obtained with the
device to be tested, apply a 17.7N (1.8Kg) force to the side of
a device being tested.
This force shall be applied for 60+1 seconds.
Also the force shall be applied gradually as not to apply a
shock to the component being tested.
* Apply 2N force for 0402 size.
Magnification of 20X or greater
may be employed for
inspection of the mechanical
integrity of the device body,
terminals and body/terminal
junction.
Before, during and after the
test, the device shall comply
with all electrical requirements
stated in this specification.
