Chip Resistor Surface Mount
AEC-Q200 Test 18
J-STD-002
Electrical Test not required Magnification 50X
SMD conditions:
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235± 3 °C for 5± 0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215± 3 °C for 5± 0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260± 3 °C for 7± 0.5 seconds.
Well tinned (≥95% covered)
No visible damage
AEC-Q200 Test 21
AEC-Q200-005
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
Bending for 0201/0402: 5 mm
0603/0805: 3 mm
1206 and above: 2 mm
Holding time: minimum 60 seconds
± (1.0%+0.05Ω )
<50 mΩ for Jumper
Temperature
Coefficient of
Resistance (T.C.R.)
IEC 60115-1 4.8
MIL-STD-202 Method 304
At +25/–55 °C and +25/+125 °C
Formula:
T.C.R= ------------------------- × 10
6
(ppm/°C)
Where
t
1
=+25 °C or specified room temperature
t
2
=–55 °C or +125 °C test temperature
R
1
=resistance at reference temperature in ohms
R
2
=resistance at test temperature in ohms
2.5 times of rated voltage or maximum
overload voltage whichever is less for 5 sec
at room temperature
± (1.0%+0.05Ω )
<50 mΩ for Jumper
- Sulfur (saturated vapor) 1000 hours,
90±2 °C unpowered
- Sulfur 750 hours, 105 °C. unpowered
