Chip Resistor Surface Mount
T
T
E
E
S
S
T
T
S
S
A
A
N
N
D
D
R
R
E
E
Q
Q
U
U
I
I
R
R
E
E
M
M
E
E
N
N
T
T
S
S
High Temperature
Exposure
AEC-Q200 Test 3
MIL-STD-202 Method 108
1,000 hours at T
A
= 155 °C, unpowered
± (1.0%+0.05Ω)
<50 mΩ for Jumper
AEC-Q200 Test 6
MIL-STD-202 Method 106
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
± (0.5%+0.05Ω) for D/F tol.
± (2.0%+0.05Ω) for J tol.
<100 mΩ for Jumper
AEC-Q200 Test 7
MIL-STD-202 Method 103
1,000 hours; 85 °C / 85% RH
10% of operating power
Measurement at 24± 4 hours after test conclusion.
± (3.0%+0.05Ω)
<100 mΩ for Jumper
AEC-Q200 Test 8
MIL-STD-202 Method 108
1,000 hours at 125 °C, derated voltage applied for
1.5 hours on, 0.5 hour off, still-air required
± (1.0%+0.05Ω)
<100 mΩ for Jumper
Resistance to
Soldering Heat
AEC-Q200 Test 15
MIL-STD-202 Method 210
Condition B, no pre-heat of samples
Lead-free solder, 260± 5 °C, 10± 1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (0.5%+0.05Ω) for D/F tol.
± (1.0%+0.05Ω) for J tol.
<50 mΩ for Jumper
No visible damage
AEC-Q200 Test 16
MIL-STD-202 Method 107
-55/+125 °C
Number of cycles is 300. Devices mounted
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air – Air
± (1.0%+0.05Ω)
<50 mΩ for Jumper
AEC-Q200 Test 17
AEC-Q200-002
1 pos. + 1 neg. discharges
0201: 500V
0402/0603: 1KV
0805 and above: 2KV
± (3.0%+0.05Ω)
<50 mΩ for Jumper
Table 4 Test condition, procedure and requirements
